3D Physical Design Engineer

About The Role

As a member of our tight knit physical design team, you will be working on the design and analysis of 3D integrated products. This role involves a combination of traditional ASIC/SoC physical design skills, packaging, power, clock and cooling analysis. You will work closely with the architecture and RTL team to do R&D on novel concepts for 3D integration. 

Skills and Qualifications

Required 

•     10+ years of physical design/verification experience. 
•     Strong knowledge of block level and full-chip physical verification methodology. 
•     Expert at optimizing for the best power/performance and area.
•     Experience with the complete physical design flow. Knowledge of Synopsys tool suite is a plus. 
•     Expert with ICV or Calibre tools resolving block and full-chip DRC and LVS issues. 
•     Expert with IR/EM analysis and resolution.
•     Strong ability in scripting languages like Tcl and Python. Ability to make flow enhancements. 
•     Demonstrated ability to work with RTL teams to optimize for physical design.
•     Knowledge of 2.5D or 3D packaging solutions.
•     Must have experience with 3d physical design, 3d die stacking, 3d chip design, die-to-die or wafer-to-wafer.

Preferred    

•     Experience doing full chip floor planning and integration.   
•     Knowledge of clock distribution.
•     Knowledge of cooling analysis.